NVIDIA GeForce GTX 1080 (GTX 1800) would launch on May 27th, which is just 4 days before Computex, allowing AIB partners to show their cards at the event. The problem about the date is that it’s not Tuesday or Thursday and I don’t remember NVIDIA releasing anything on Friday.
Yeah…I’m currently running a GTX760…so I too am anxious to upgrade to something. Though I must say, DCS World is working fine on my current setup. The only game I’d probably really benefit from an upgrade with would be X-Plane…which can be a real resource hog…
I’m running two ViewSonic VA2703 27" LED (1920 x 1080)…but I don’t really need to drive both when gaming, just one. I only use the second monitor for writing, normal daily stuff, but for gaming I only use the one that is on front of me…
A 980 would be more than fine, the 970 has some crippled memory, cant remember the details? it will show up on a Google search though, still a fine card though.
I dont think the prices of older cards will drop too much with the advent of a new one from Nvidia and afore you know it they will be sold and phased out quite fast.
I’m lucky enough to have a GTX980 SC 4GB and a GTX980 Titan X 12GB in this main machine and nothing taxes them at 2560x1600 and 3440x1440 res.
This new card sounds exciting though and I really cant justify one, but if I was in the market I’d wait maybe 3 months after its release, they will release a Ti or X version about then, Nvidia like to drip feed us with releases it seems
01:34PM EDT - 170TF FP16 in a box. 8 P100s in a hybrid cube mesh
01:34PM EDT - A full deep learning rackmount server
01:34PM EDT - NVIDIA DGX-1
01:33PM EDT - But if it’s 600mm2 for just the die, that’s a huge jump in the size of dies being produced on 16nm/14nm TSMC/Samsung FinFET
01:33PM EDT - Need to get confirmation on whether 600mm2 is just the GPU die, or if they’re counting other parts as well
01:32PM EDT - “We’ll ship it… soon”
01:32PM EDT - P100 servers coming in Q’17
01:31PM EDT - P100 in volume production today
01:30PM EDT - NV wanted new algorithms to take advantage of the hardware
01:29PM EDT - Recapping NVLink. 5x the aggregate speed of PCIe 3.0
01:29PM EDT - “TSMC CoWoS® (Chip-On-Wafer-On-Substrate) services use Through Silicon Via (TSV) technology to integrate multiple chips into a single device. This architecture provides higher density interconnects, decreases global interconnect length, and lightens associated RC loading resulting in enhanced performance and reduced power consumption on a smaller form factor.”
01:28PM EDT - Chip on Wafer on Substrate, the largest such chip ever made